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Thermosetting Film

TSF (Thermosetting Film) is a heat-activated film product with thermosetting characteristics. It has no viscosity at room temperature. In the heating process, the film will be cured by chemical crosslinking reaction to form a solid structure with good stability. Viscosity can reach semi-structural to structural strength, suitable for all kinds of material strength bonding, a variety of activation temperature options, good die-cutting, excellent performance for industrial production to facilitate. In addition to thermally reactive products, UV-activated products (UVAF, UV-activated Film) are also available.
Features
● Excellent chemical resistance, effectively extending the product's lifespan.
● Ultra-high adhesive strength and high holding power, suitable for permanent fixation.
● Low-temperature activated adhesive design, offering a broader range of application scenarios.
● Outstanding dimensional stability and excellent die-cutting performance, suitable for small-sized bonding applications.
● Wide application range with excellent adhesion to various material surfaces.
● Functionality can be enhanced by adjusting the adhesive formulation, such as conductivity or yellowing resistance.
 
Applications
High-strength bonding of soft materials such as fabrics and leather
High-strength bonding of soft materials such as fabrics and leather
High-strength bonding of electronic components and parts
High-strength bonding of electronic components and parts
Product Series
Products Model Product thickness
(μm)
Adhesive Activation temperature
(° C)
Product color Product characteristics
TSF thermosetting adhesive film (for soft material bonding) CRN-DPxxxWH 30-300 PU 75 White/Black Medium and low modulus, excellent chemical resistance, suitable for bonding soft material surfaces
TSF thermosetting adhesive film (for parts bonding) CRN-DPxxxWH 30-300 PU 75 White/Black High modulus, excellent chemical resistance and impact resistance, suitable for bonding stainless steel/ink glass
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