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Reflow Soldering Resistant Tissue Tape

This industrial-grade adhesive tape uses non-woven fabric as the carrier, coated on both sides with high-temperature resistant acrylic adhesive, and laminated with a special glassine release liner. It offers excellent temperature resistance and die-cutting performance, and the release liner can be easily removed after reflow soldering processes.
Features
● High Initial Tack
● Excellent Conformability
● High Temperature Resistance for Reflow Soldering
● Easy Release of Liner Material
 
Applications
FPC bonding during reflow soldering processes
FPC bonding during reflow soldering processes
Product Series
Products Model Thickness (μ) Specification (mm) Product characteristics
Reflow-resistant Tissue tape T805G 50 1020 * Acrylic adhesive has excellent temperature resistance of 260 ℃ * After reflow soldering, it still has high adhesion * Release material is easy to peel off after reflow soldering process * Ultra-thin non-woven substrate, no glue overflow during die-cutting
Reflow-resistant Tissue tape T807G 75 1020 * Acrylic adhesive has excellent temperature resistance of 260 ℃ * After reflow soldering, it still has high adhesion * Release material is easy to peel off after reflow soldering process * Ultra-thin non-woven substrate, no glue overflow during die-cutting
Reflow-resistant Tissue tape T810G 100 1020 * Acrylic adhesive has excellent temperature resistance of 260 ℃ * After reflow soldering, it still has high adhesion * Release material is easy to peel off after reflow soldering process * Ultra-thin non-woven substrate, no glue overflow during die-cutting
Reflow-resistant Tissue tape T816G 160 1020 * Acrylic adhesive has excellent temperature resistance of 260 ℃ * After reflow soldering, it still has high adhesion * Release material is easy to peel off after reflow soldering process * Ultra-thin non-woven substrate, no glue overflow during die-cutting
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